There are two methods of solderability testing. Method 1 is known as “dip and look” which is for leaded and leadless terminations. This method includes pre-conditioning if applicable, the application of flux, and the immersion of the terminations into molten solder. Method 2 is a Surface Mount Process Simulation test.
When would you use a solderability test?
Solderability testing helps determine if a component provides the degree of wetting necessary for a solid solder connection.
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Solderability testing is effective during different aspects of production, such as when:
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Solderability testing is effective during different aspects of production, such as when:
- Evaluating PCB coating, solder, and flux.
- Benchmarking.
- Performing quality control.
What is a wetting balance test?
The wetting balance test is used to measure the wetting forces between molten solder and the test surfaces as a function of time. Solderable surface differ in speed and strength of adhesion. The wetting balance measures the time for the solder to wet the component termination or pad.
